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Automatic PCB Chip Position Identified BGA Rework Machine High Speed

Shenzhen Wisdomshow Technology Co.,ltd
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    Buy cheap Automatic PCB Chip Position Identified BGA Rework Machine High Speed from wholesalers
     
    Buy cheap Automatic PCB Chip Position Identified BGA Rework Machine High Speed from wholesalers
    • Buy cheap Automatic PCB Chip Position Identified BGA Rework Machine High Speed from wholesalers

    Automatic PCB Chip Position Identified BGA Rework Machine High Speed

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    Brand Name : WDS
    Model Number : WDS-750
    Certification : CE
    Payment Terms : T/T, Western Union, MoneyGram
    Supply Ability : 150 UNITS PER MONTH
    Delivery Time : 8-15 working days
    • Product Details
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    Automatic PCB Chip Position Identified BGA Rework Machine High Speed

    WDS-750 Optical Alignment BGA Rework Station


    parameter Specification:


    Total power6800W
    Upper heating power1200W
    Bottom heating power1200W
    Bottom IR heating power4200W(2400W is controlled)
    Power supply(Single Phase) AC 220V±10 50Hz
    Location wayOptical camera+ V-shape card slot + laser position for fast location
    Temperature controlHigh precision K sensor closed loop control,independent temperature control with ±1 ℃ precision
    Appliance selectionHigh sensitive touch screen + temperature control mode +Panasonic PLC +step driver
    Max. PCB size550×480mm
    Min. PCB size10×10mm
    Sensor4units
    Chip amplification multiple1-200X
    PCB thickness0.5-8mm
    Chip size0.2*0.4mm-9cm
    Min. chip space0.15mm
    Max. mount loading100G
    Mount precision±0.01mm
    Overall sizeL670×W770×H900mm
    Optical cameraCan be removed front and back,left and right,prevent the dead angle
    Machine weight90kg

    Features:


    1.Touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;


    2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield;


    3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;


    4.Auto feed chip,auto pick up chip,auto blowing chip,can identify the central position automatically when optical alignment;


    5.Multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;


    6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 ℃;


    7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;


    8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users;


    9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts;


    10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).


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