Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework.
      Repair steps:
1) Separate the BGA chip from mother board -we called desoldering
2) Clean Pad
3) Reballing or replace a new BGA chip directly
4) Alignment/Positioning - Depend on experience ,silk frame ,optical camera
5) replace a new BGA chip - we called Soldering

  Main Features
1.Hot air head and mounting head integration design, with auto soldering and desoldering functions.

2.Independent 3 heaters, upper and lower heaters can realize move synchronously and automatically,can reach IR every position.Lower heater zone can remove up and down,support PCB board. bottom preheating area along X/Y axis. Lower heater can move up/down and support PCB,auto-controlled by motors. It can realize the upper and lower heater able to move towards target BGA, without moving PCB.

3.PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.

4.Unique bottom preheating table made of Germany-imported good quality heating materials plated IR tube & constant temperature glass anti-dazzle (heat-resist up to 1800 C), pre-heating area up to 500*420mm.

5.Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.

6.X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient,make the most use of the equipment space,realization of repairing large area PCB with a smaller volume of equipment.The Max plate size can reach 650*610mm,no repair dead corner.

7.Double rocker control the camera and upper and lower heating platform to make sure
the alignment precision accuracy.

8.Inbuilt vacuum pump, rotate 360 in angel; fine-adjusting mounting suction nozzle.

9.Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; zero pressure available to smaller BGA pickup and mounting.